BCM56870 / 56873 / 56770 / 56771 / 56277 · Four sub-variants

Broadcom Trident 3 Trident 3 Switches Four sub-variants and ten qualified platforms.

Mature merchant silicon for the DC leaf, qualified across TD3-X7 (2.0 to 3.2 Tbps · 25G/100G leaf-spine), TD3-X5 and TD3-X4 (1-2 Tbps · 10G/25G ToR), and TD3-X2 (108 to 130 Gbps · 1G management). All ten platforms run the same OcNOS-DC software as TH4 and TH5.

X7TD3-X7 · 2.0 to 3.2 Tbps X5TD3-X5 / X4 · 1-2 Tbps X2TD3-X2 · 108 to 130 Gbps 04Inside Trident 3
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4variants
X7 · X5 · X4 · X2
10SKUs
OcNOS-DC Qualified
3ODMs
Edgecore · UfiSpace · Celestica
1RU
Every platform
1G→100G
Port Speed Range
X7
TD3-X7 · 25G/100G DC leaf-spine

TD3-X7: 2.0 Tbps 25G ToR or 3.2 Tbps 100G spine.

Modern 25G server attachment with 100G uplinks (AS7326-56X) or pure 32×100G spine (AS7726-32X / S9110-32X). Same OcNOS-DC software as TH-class.

Edgecore 2.0 Tbps

AS7326-56X

DC leaf · 25G ToR with 100G uplinks
48 × 25G SFP28 + 8 × 100G QSFP28
1RU

25G server access ToR with eight 100G uplinks. Right ratio for densely populated server racks.

DatasheetPDF
Edgecore 3.2 Tbps

AS7726-32X

DC spine · 32 × 100G
32 × 100G QSFP28
1RU

100G spine in a small/mid Clos fabric. Pair with TD3-X7 leaves at the bottom.

DatasheetPDF
UfiSpace 3.2 Tbps

S9110-32X

DC spine · 32 × 100G
32 × 100G QSFP28
1RU

Architectural twin of AS7726-32X: same chip, same port mix, different ODM. Pick by procurement.

DatasheetPDF
X5
TD3-X5 / X4 · 10G/25G DC leaf

TD3-X5 and TD3-X4: 1-2 Tbps · 10G/25G ToR with 100G uplinks.

Lower-tier Trident 3 silicon: TD3-X4 for legacy 10G server fleets (AS5835-54T copper, AS5835-54X fiber) and TD3-X5 for 25G refresh deployments (S8901-54XC and S8901-54XC-16G). Six 100G uplinks per box. Same EVPN-VXLAN feature plane as TD3-X7, with a different capacity envelope and per-port economics.

Edgecore 1.08 Tbps

AS5835-54T

10G ToR · copper RJ45
48 × 10G RJ45 + 6 × 100G QSFP28
1RU

Copper-based 10G ToR with 100G uplinks. Right shape for legacy server fleets on copper.

DatasheetPDF
Edgecore 1.08 Tbps

AS5835-54X

10G ToR · fiber SFP+
48 × 10G SFP+ + 6 × 100G QSFP28
1RU

Fiber-based 10G ToR with 100G uplinks. Same BCM56771 chip as the -54T but SFP+ optical cages instead of copper.

DatasheetPDF
UfiSpace 2.0 Tbps

S8901-54XC

25G ToR · TD3-X5
48 × 25G SFP28 + 6 × 100G QSFP28
1RU

25G ToR sized for the TD3-X5 envelope. Step up from -54T/-54X to 25G server ports.

DatasheetPDF
UfiSpace 2.0 Tbps

S8901-54XC-16G

25G ToR · TD3-X5
48 × 25G SFP28 + 6 × 100G QSFP28
1RU

A higher-memory build of the S8901-54XC with the same TD3-X5 chip and port mix.

DatasheetPDF
X2
TD3-X2 · 1G management / OOB

TD3-X2: 108 to 130 Gbps · 1G access · 10G uplinks.

Out-of-band / management switches for the DC fleet. 48 × 1G ports for IPMI, console, and OOB connectivity. 6-8 × 10G uplinks. Three platforms from three ODMs (Edgecore, UfiSpace, Celestica), so the management network has a choice of supplier.

UfiSpace 130 Gbps

S6301-56ST

1G management · 8 × 10G
48 × 1G + 8 × 10G SFP+
1RU

Management network or out-of-band switch for the DC fleet. 1G everywhere, 10G uplinks.

DatasheetPDF
Celestica 128 Gbps

DS1000

1G management · 8 × 10G
48 × 1G + 8 × 10G SFP+
1RU

Celestica build of the same TD3-X2 management profile. Pick by vendor relationship: only Celestica platform in the OcNOS HCL.

DatasheetPDF
Edgecore 108 Gbps

AS4625-54T

1G management · 6 × 10G
48 × 1G RJ45 + 6 × 10G SFP+
1RU

Copper RJ45 1G management with six 10G uplinks, a common shape for OOB networks.

DatasheetPDF

Four sub-variants, one architectural family.

Trident 3 is Broadcom DC merchant silicon for 1G to 100G ports, with a packet pipeline refined over years of production deployment. The platforms here use five Broadcom chips across four sub-variants, each suited to a typical role.

What the sub-variants share: the same OcNOS-DC software. Brownfield refresh between sub-variants, for example TD3-X5 to TD3-X7, keeps configuration and automation intact. Forward refresh to TD4 also stays clean (same OcNOS-DC).

PRINCIPLE 01

Four sub-variants, one family.

BCM56870 and BCM56873 (X7), BCM56770 (X5), BCM56771 (X4), BCM56277 (X2). Different capacity envelopes, same forwarding architecture, same OcNOS-DC software.

4 sub-variants · 5 chips
PRINCIPLE 02

100G QSFP28 ports.

The TD3-X7, X5 and X4 platforms here top out at 100G QSFP28, with breakout to 4 × 10G or 4 × 25G.

100G QSFP28 · breakout
PRINCIPLE 03

EVPN-VXLAN at line rate.

Hardware VXLAN VTEP encapsulation and decapsulation. ESI-LAG multihoming on the leaf, IRB, and the full BGP EVPN control plane on OcNOS-DC.

VXLAN · ESI-LAG · IRB
PRINCIPLE 04

Mature silicon.

Years of high-volume production. A known thermal envelope and per-port cost for the leaf tier.

1G to 100G · 1RU
Brownfield migration is clean. The same OcNOS-DC software runs across TD3, TD4, TH4, and TH5. Refresh selectively: keep TD3 where it works (10G ToR, OOB), upgrade to TD4/TH-class where 400G is required.

Questions DC architects ask

Ten open-hardware platforms across four sub-variants. TD3-X7 (2.0 to 3.2 Tbps): Edgecore AS7326-56X, AS7726-32X; UfiSpace S9110-32X. TD3-X5 (2 Tbps): UfiSpace S8901-54XC and S8901-54XC-16G. TD3-X4 (1.08 Tbps): Edgecore AS5835-54T, AS5835-54X. TD3-X2 (108 to 130 Gbps management): UfiSpace S6301-56ST, Celestica DS1000, Edgecore AS4625-54T. All run OcNOS-DC, in the edition offered for each platform: pick by capacity tier and port mix.
Different roles. TD3-X7 (BCM56870 and BCM56873): modern 25G/100G DC leaf and small-fabric spine. 2.0 to 3.2 Tbps capacity. TD3-X5 (BCM56770): 25G DC leaf. 2 Tbps. TD3-X4 (BCM56771): 10G DC leaf with 100G uplinks. 1.08 Tbps. TD3-X2 (BCM56277): 1G management/out-of-band switch with 10G uplinks. 108 to 130 Gbps. All four capacity tiers share the Trident 3 family architecture.
TD4 (BCM56880) is the modern 400G upgrade path: 12.8 Tbps with 32 × 400G in 1RU and IPoDWDM. TD3 maxes at 100G ports. Refresh when: rack densities push you beyond 25G server NICs, or you want 400G ZR coherent direct in the leaf, or 100G uplinks are no longer enough headroom. Same OcNOS-DC software runs on both, so brownfield refresh keeps configs and gNMI pipelines intact.
Yes, for the right roles. TD3 is mature silicon with a low cost per port. Where it fits: 10G/25G DC leaf at scale, 100G smaller-fabric spine, 1G management/OOB networks. Where it doesn't fit: 400G uplinks (use TD4), AI fabric with 100G+ NICs (use TH-class), or SP edge with timing (use Q-family). The OcNOS-DC qualification list keeps TD3 because real fleets still run it.
Yes: BGP EVPN control plane with hardware VXLAN encapsulation and decapsulation, EVPN multihoming (ESI-LAG), and symmetric or asymmetric IRB. EVPN-VXLAN is available in the OcNOS-DC IPBASE and PLUS editions offered on the TD3-X7, TD3-X5, and TD3-X4 platforms. On the TD3-X2 management switches, the offered edition depends on the platform.
Vendor diversity at the management-switch tier. The Celestica DS1000 is a TD3-X2 management and OOB switch (48 × 1G RJ45, 8 × 10G SFP+), giving DC operators a third supplier for the management network. The DS1000 is the only Celestica platform in the current OcNOS HCL.
For 400G ports, use TD4. For a DC spine above ~3.2 Tbps, use a TH-class platform. For SP edge with timing, use Qumran. For an AI fabric with lossless RoCEv2 at 100G+ NICs, use TH4 or TH5, since TD3 tops out at 100G ports. Trident 3 fits mature, predictable, cost-effective DC leaf or management roles at 10G/25G/100G.

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The product datasheet plus short, technical downloads that go further than this page.

Datasheet

OcNOS-DC Datasheet

Full OcNOS-DC specification: the EVPN-VXLAN and Ethernet for AI feature set, software SKUs, supported hardware platforms, and the solution ordering guide.

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Solution Brief

EVPN-VXLAN Data Center Fabric

Leaf-spine data center fabric on EVPN-VXLAN: a VRF and VNIs per tenant, EVPN multihoming, BGP unnumbered and route-target filtering.

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Solution Brief

OcNOS 800G Lossless AI Fabric

Lossless RoCEv2 fabric on Tomahawk 5 spines: SKU tiers, qualified platforms, and deployment architecture.

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Refreshing a Trident 3 fabric, or growing into one?

30-minute architecture session with an OcNOS network architect. Bring your DC topology, server NIC speeds, and timeline, and leave with a sized BoM across TD3 sub-variants and a forward-compatible path to TD4 or TH-class.

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